Teledyne FLIR Adds New Boson+ Thermal Resolution Options, Radiometry, and MIPI Interface Simplifying Embedded System Integration
Industry-leading 20-mK-sensitivity Boson+ with 640×512 and 320×256 resolutions is ideal for unmanned platforms, security applications, handhelds, wearables, and thermal sights
Teledyne FLIR, part of Teledyne Technologies Incorporated, today announced the expansion of the Boson+ thermal camera module product line with twenty-four compact models featuring 320 x 256 resolution. Radiometry, the ability to take the temperature of every pixel, as well as both MIPI and CMOS interfaces are now also available on all resolutions. With these updates and a thermal sensitivity of 20 millikelvin (mK) or less, Boson+ is the most sensitive longwave infrared (LWIR) camera line in the market and is ideal for integration in unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), automotive, wearables, security applications, handhelds, and thermal sights.
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