The power transfer of a charger IC designed with the previous 60V BCD process can be 100 watts at best, but the transfer can increase up to 240 watts if the charger IC is designed with the 150V BCD process.
Going forward, LG will leverage its renewable energy expertise to unlock value for customers in new ways.
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec (Euronext Paris) have announced a research collaboration to develop next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles and advanced high-voltage electronic devices.
The second edition of Southeast Asia’s flagship geospatial and location intelligence event grows to host fast-developing industry solutions.
The new vertical device architecture demonstrates path to scaling beyond nanosheet, which can enable 85 percent energy reduction compared to scaled finFET transistors.
Regionally, China, Korea, and Taiwan are projected to remain the top three destinations for equipment spending in 2021.
Industry leaders from the semiconductor ecosystem to address sustainability challenges and supply chain disruption through green factories and advanced manufacturing systems at SEMICON Southeast Asia 2022.
Designed and manufactured by Murata, the RFID module is inserted into a simple spring antenna, designed and manufactured by HANA Technologies, thus enabling it to link to the tire ecosystem.
The Qualcomm QRB5165 processor, customised for robotics applications, is architected for running complex AI, deep learning workloads, and on-device edge inference efficiently while using lower power.
Annual 6-inch SiC wafer demand from EV market expected to Reach 1.69 million units in 2025 as 800V charging architecture nears, says TrendForce.
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available on request with a full product release planned for the second quarter of 2022. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned.
Amkor Technology, Inc., one of the world’s largest providers of outsourced semiconductor packaging and test services, announced its plans to build a smart factory in Bac Ninh, Vietnam.
Its new Filogic solutions combine advanced Wi-Fi and Bluetooth features with the latest voice processing and power-management technologies.
ADLINK’s embedded MXM graphics modules are the first modules to use NVIDIA’s embedded GPUs based on NVIDIA Ampere architecture, bringing edge computing and embedded AI to numerous vertical markets including healthcare, manufacturing, transportation, and more.
The opening ceremony – a hybrid in-person and online event – was attended by DISG, Taiwan’s local Representative Office and Google Cloud.
To make this a reality, thousands of new electronic components are needed to be developed to handle the tremendous amount of information and data that must be collected, analysed, and responded to.
Alps Alpine’s new ambient air sensor module monitors the surrounding environment with high-accuracy sensing of carbon dioxide (CO2), temperature, humidity, and other parameters.
Funds will be deployed to explore growth opportunities in Singapore and Malaysia, and kickstart its expansion into Thailand.
The company combines in-depth knowledge of the outdoor and indoor built environment with a unique library of behaviors designed through millimeter accurate observation of how people move with one another through the world, from sidewalk etiquette to entering and exiting buildings with one another and beyond.
The partnership aims to accelerate technical innovation in the automotive industry to achieve a sustainable society.
Thin, light, and bendable Organic Photovoltaic (OPV) is suitable for indoor and semi-outdoor environments.
Powering Innovation –5G And Beyond: Mr Gan Kim Yong’s speech highlights confidence in Singapore’s abilities to be an economy that corporations and business leaders in the Semicon Industry could trust and depend on for growth opportunities that lie ahead.
Baidu, Inc., the Chinese Internet giant, is flexing its muscles for the future and proposes itself as a leader in AI and mobility.
Fully Integrated TMC6140-LA Simplifies Design Of High-Performance Brushless DC Motor Drives And Improves Efficiency By 30 Percent.
Dimensity 920 And Dimensity 810 Chipsets Bring Brilliant Imaging, Smarter Displays And Boosted Performance Together For Incredible Mobile Experiences.
Optimised for the Development of Compact, High-efficiency Devices, 8-channel Inputs that Provide World Class Flexibility and Accuracy: The Power Analyzer PW8001 and New AC/DC Current Sensors CT6872 and CT6873.
The Optima Group has developed machine solutions to increase the production capacity of fuel cells.
The investment from POSCO in the facilities of SNNC transforms it into a high purity nickel refining factory and plans to produce 20,000 tons (only nickel contents) per year by 2023.
An Overview Of Industrial Robot Usage In The Automotive Industry, Which Nowadays Is The Most Important Customer Of The Industrial Robotic Market.
Non-destructive advanced scanning acoustic microscopy detects flaws in specialty metals, materials, and packaging of semiconductor devices.
Guest of honour Mr. Gan Kim Yong, Singapore’s Minister for Trade and Industry, will kick off the SEMICON SEA 2021 conference, 23-25 August 2021.
Globalfoundries has announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus.
As drivetrain electrification and advanced driver assistance systems change the way we drive, the number and complexity of comfort features and other body functions in cars increases constantly. To tackle this challenge, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the Traveo II Body microcontroller family to the open market. This product family addresses a …
Infineon Technologies has introduced a new IMD110 SmartDriver series.
nfineon Technologies AG is expanding its wireless portfolio of high performance, reliable and secure offerings.
300mm fab investments in 2020 will grow by 13 per cent year-over-year (YoY) to eclipse the previous record high set in 2018.
Air Products has been awarded a long-term onsite contract from a global leader in memory and storage solutions to supply its state-of-the-art new facility in Penang.
Analog Device and Maximhas entered a definitive agreement under which ADI will acquire Maxim in an all-stock transaction that values the combined enterprise at over $68 billion.
STMicroelectronics revealed its partner-led growth strategy for Asia as well as its industrial strategy and strategic thrusts for the coming year during a recent online media engagement.
With SECORA ID, Infineon Technologies AG offers an easy-to-integrate security platform for contactless digital ID documents.
Infineon Technologies AG continues to expand its comprehensive silicon carbide (SiC) product portfolio with 650 V devices.
SMA and Infineon are supporting the growing trend of photovoltaic systems with the latest generation of innovative silicon carbide (SiC)-based solar inverters.
Monitoring solutions are essentially IoT applications that require lots of sensors. By Nadia Cheraitia, Schneider Electric.
The Coronavirus Disease 2019 (COVID-19) is affecting China and is spreading within East Asia and into Europe and North America.
Mouser Electronics Incorporated is now offering the i.MX 8QuadMax and 8QuadPlus applications processors from NXP Semiconductors.
Mouser Electronics incorporated has announced a global distribution agreement with Zipcores, designers of intellectual property (IP) cores for implementation on FPGA, ASIC and SoC devices.
Keysight Technologies, NOIEC and CompoundTek, will work together to establish layout design standards for automated testing of photonic integrated circuits
Global semiconductor manufacturing equipment sales will drop 10.5 percent to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion but stage a 2020 recovery and set a new high in 2021.
Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, has unveiled its new Horticulture Applications Site on Mouser.com.
Micron expanded facility provides flexibility in cleanroom space to facilitate technology transitions to advanced nodes of 3D Nand technology.
Smart factories are fast becoming mainstream in the manufacturing industry, offering a new level of efficiency and productivity.
Mouser Electronics Incorporated, the New Product Introduction (NPI) leader empowering innovation has stocked the i.MX 8M Mini applications processors from NXP Semiconductors.
The semiconductor industry is big – estimated to top US$339 billion in annual sales in 2017. What is more, many of the players that dominate semiconductor design and fabrication are also large. That is because building a state-of-the-art wafer fab today is an expensive proposition. Pure-play foundry TSMC, for instance, is spending US$3 billion for a wafer fab in Nanjing, China that will make chips using a 16-nanometer technology starting in the second half of 2018, according to the analysts at IC Insights. To take on projects of that size, a company typically must be large and have economies of scale.
The rise of IoT has enabled a greater demand for low-power efficient semiconductor components. By Claudia Mosca, Infineon Technologies