Pioneering Precision: Micraft’s Leading Edge in Microfabrication

Pioneering Precision: Micraft’s Leading Edge in Microfabrication

In an enlightening interview, Mason Huang, President of Micraft System Plus Co., Ltd., sheds light on groundbreaking advancements in microfabrication that enhance efficiency and sustainability in the semiconductor industry.


Micraft System Plus Co., Ltd. is spearheading revolutionary changes in the semiconductor field, under the guidance of its President, Mason Huang. The company has made significant strides in micro LED technology and advanced semiconductor packaging technology, emphasizing innovations that combine high precision with environmental consciousness.

One of the standout achievements is the development of a micro LED single die repair process that targets defects smaller than 10 micrometers by 10 micrometers, effectively pushing towards zero defects in panel molding. This precision is vital for industries requiring high-definition displays and advanced sensors, enhancing yield and reducing micro LED waste.

In the realm of AI, Micraft is enhancing semiconductor manufacturing through the highly precise mechanism design and software alignment algorithm integrated in processes such as Chip on Wafer on Substrate (CoWoS) packaging for AI chips. This innovation not only boosts efficiency and product quality but also aligns with global sustainability trends by optimizing energy usage during production.

Huang also highlights Micraft’s initiatives towards sustainability, including the implementation of energy monitoring systems to meet stringent ESG criteria. These measures are part of a broader strategy to minimize the environmental impact across the company’s operations.

Moreover, Micraft’s mastery over large-scale substrate production, exemplified by the G 4.5 generation panels, offers substantial cost and time efficiencies, providing their clients with a crucial competitive advantage.

Looking ahead, Micraft is gearing up for the production equipment of even larger G6 panels, which promise to revolutionize the industry further by significantly enhancing production efficiency and reducing costs, maintaining their lead in microfabrication technology.

Revolutionizing Microfabrication: Micraft System Plus Co., Ltd.’s Path to Technological Prowess

In a recent discussion, Mason Huang, President of Micraft System Plus Co., Ltd., delves into the company’s latest advances in microfabrication technology, emphasizing innovations in micro LED technology and advanced semiconductor packaging tool development, while underscoring a significant thrust toward sustainability.

In the swiftly evolving realm of semiconductor technology, staying ahead means pushing the boundaries of innovation and efficiency. Micraft System Plus Co., Ltd., under the stewardship of its President, Mason Huang, is pioneering advancements that are not only enhancing product performance but are also steering the industry towards a more sustainable future.

Innovating Micro LED Technology

A notable breakthrough in the semiconductor industry has been in the domain of micro LED technology, where Micraft has taken significant strides. One of the most critical challenges in micro LED manufacturing is achieving zero defects post panel after molding process. Huang discusses an innovative single die repair process developed by Micraft, capable of addressing repairs with a resolution small enough to target defects on tiles smaller than 10 micrometers by 10 micrometers. This capability is pivotal for industries where precision is crucial, including high-definition displays and advanced sensor systems.

“The single die repair process has been a game-changer,” Huang states. “It not only enhances the yield but also significantly reduces the repair process time, which is a step forward in our environmental commitments.”

Artificial Intelligence in Microfabrication

The integration of artificial intelligence (AI) in microfabrication processes marks another frontier Micraft is exploring. AI applications in semiconductor manufacturing are vast, ranging from maintenance of machinery to optimization of fabrication processes. Huang highlights the development of AI chip packaging technology, specifically Chip on Wafer on Substrate (CoWoS), which enhances the performance of AI chips.

“We are utilizing AI to streamline complex processes such as 2.5D packaging technology,” Huang explains. “This not only improves the efficiency of our operations but also reduces errors, leading to higher quality end products.”

Sustainability Initiatives

In response to global sustainability trends, Micraft has incorporated various measures to reduce its environmental impact. One significant area is power consumption. The company has introduced systems to monitor and optimize the energy use of its equipment during both active and idle periods. These systems are part of a broader strategy to meet stringent Environmental, Social, and Governance (ESG) criteria.

“We work closely with third-party consultants to assess and improve our environmental footprint across the supply chain,” says Huang. This collaboration has led to a deeper understanding of their operational impact and fostered innovations that contribute to a sustainable ecosystem.

Advancing Chip Fabrication Techniques

Discussing further, Huang delves into the specific technologies underpinning Micraft’s chip fabrication success.

The company leverages advanced optical design, software and mechanical design for compound semiconductors fabrication like SiC. “We have developed an efficient tool utilizing laser technology for the SiC process. “ he elaborates.

Competitive Advantages in Fabrication Processes

Micraft’s comprehensive grasp of the G1 and G2 fabrication processes has also cultivated competitive advantages. The company has evolved to delivering tool for G 4.5 generation panels, emphasizing large-scale substrates that reduce production costs and time significantly.

“The size of the panels we are now able to manufacture allows our clients, particularly in the display sector, to achieve economies of scale previously deemed unattainable,” Huang remarks. This capability is critical in an industry where cost pressures are constant, and productivity improvements are continuously sought.

Looking to the Future: Bigger and Better

As for future directions, Micraft is not resting on its laurels. Huang discusses the development of G6 panels, which will be four times larger than the current G 4.5 panels. This scale-up is expected to revolutionize the industry by further reducing costs and enhancing production efficiency.

“Our next-generation technologies will continue to push the limits of what is possible in microfabrication,” asserts Huang.

Innovative Repair Technologies and Precision Mechanical Design

Another area where Micraft excels is in their innovative repair technologies for micro LEDs. These technologies allow for in-panel repairs that avoid the complexities and inefficiencies of traditional methods. Additionally, the company’s focus on precise mechanical design is more critical than ever as panels increase in size.

“Our mechanical designs need to be incredibly precise,” explains Huang. “We are talking about tolerances in the realm of minus two microns, which is exceptionally demanding.”


Micraft System Plus Co., Ltd.’s journey through innovation, sustainability, and technological excellence illustrates a blueprint for the semiconductor industry’s future. With leaders like Mason Huang at the helm, the path forward is not only about enhancing capabilities but doing so responsibly and sustainably. The integration of cutting-edge technology with a commitment to environmental stewardship positions Micraft as a leader not just in technology but in corporate responsibility as well.





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