The VT-X750-V3 delivers advanced, true 3D inspection of electronic substrates to meet the growing needs of fifth-generation mobile communication systems (5G), electric vehicles (EVs), and autonomous driving application products.
OMRON Corporation based in Kyoto, Japan, has announced the development of a new VT-X750-V3 system, the world’s fastest1 CT-type X-ray inspection device2 to date, and said it will be released globally on November 20. The VT-X750-V3 delivers advanced, true 3D inspection of electronic substrates to meet the growing needs of fifth-generation mobile communication systems (5G), electric vehicles (EVs), and autonomous driving application products.
In recent years, demand for electronic substrates to support 5G, EVs, and autonomous driving applications has grown rapidly, which in turn continues to raise the quality requirements of these substrates. These advanced applications may involve risks to human life and the highest-quality inspection is necessary to ensure the reliability, performance, and safety of the final products. Design, manufacturing, and inspection challenges are growing such as progressing printed circuit board assemblies (PCBA) densification through IC chipping, which relates to parts mounting on both sides of the board and further consolidation of parts to increase the number of components mounted on the board. To inspect these components with true accuracy and stability, traditional 2D X-ray imaging techniques are insufficient or incapable and 3D inspection has become essential. However, 3D X-ray imaging, image processing, and inspection take time. It is very difficult to achieve both operating effectiveness and high-quality inspection. Historically, in order to keep pace with antiquated 2D X-ray cycle-times or meet production demands, 3D CT inspection may have only been used on a portion of the assembly, for the most critical components or in an offline inspection cell away from the production line to meet 100 percent inspection requirements.
The VT-X750-V3 delivers an inspection speed 1.5 times faster than the current model, making 100 percent CT X-ray inspection of even complex substrates more achievable than ever. High-speed acquisition of clear 3D images has been actualised with unique, continuous imaging technology3 and seamless, smooth motion through OMRON’s own machine control equipment and a camera with two times4 the sensitivity of conventional technology. This allows for high-performance inspection within a shorter cycle time. In addition, the CT imaging condition settings used for inspection are more automated through ongoing OMRON AI development in order to further reduce program-tuning time. OMRON’s expertise, experience, and continuous innovation have been helping to improve customer productivity for more than 30 years.
By combining the integration of the widest range of control devices and the use of AI fully versed in solder inspection, the VT-X750-V3 is the latest offering from OMRON that embodies the “innovative-Automation” concept. OMRON offers total solutions designed to achieve zero-defect production lines.
OMRON will introduce the new VT-X750-V3 3D CT AXI system at exhibitions in Germany, North America, and Japan.
(1) The world’s fastest: As a full 3D CT-type X-ray automated inspection system, it is the world’s fastest in the substrate inspection industry, according to OMRON’s research as of October 2021.
(2) CT (computed tomography)-type X-ray automatic inspection device: Inspection device equipped with technology to capture computed processing data of 3-dimensional images when capturing the image of continuous cross-sections inside of structures that are invisible to the human eye using X-rays. The same technology as CT scanning systems utilised by medical institutions.
(3) Continuous imaging technology: Technology for imaging stereoscopic images without stopping.
(4) Twice as much as before when comparing the detection range of the conventional model and, in the same imaging condition, the degree to which an image sensor (imaging element) detects X-ray as light.
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