Its new Filogic solutions combine advanced Wi-Fi and Bluetooth features with the latest voice processing and power-management technologies.
A recent report by ResearchAndMarkets reveals that the global IoT connectivity market forecast for the period 2021-2026 is expected to grow at a CAGR of 20.9 percent to reach approximately US$439 billion by 2026. The IoT connectivity market is being driven by the rising demand for high-speed network connectivity. Adding to this, Alan Hsu, the corporate vice president and general manager, intelligent connectivity at MediaTek said, advanced connectivity technologies like Wi-Fi 6 and Bluetooth 5.2 will become a must-have for smart home devices.
Riding on the trend, MediaTek ushers the new era of smart Wi-Fi 6/6E solutions with its new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) which both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit (PMU) into a single chip. The Filogic 130A also integrates an audio digital signal processor to allow device makers to easily add voice assistants and other services into their products. These all-in-one solutions deliver energy-efficient, reliable, and high-performance connectivity in small form factor designs that are ideal for a wide range of IoT devices.
“In the coming years, advanced connectivity technologies like Wi-Fi 6 and Bluetooth 5.2 will become a must-have for smart home devices with the increasing need for more AI processing power, energy efficiency, and robust security. MediaTek’s Filogic 130 and Filogic 130A solutions offer the perfect combination of features to help drive this transition,” said Alan Hsu. “Each solution has a highly integrated design that packs the latest on-chip processing and power-management technologies into an ultra-small design no bigger than the size of a thumbnail.”
Filogic 130 and Filogic 130A both support 1T1R Wi-Fi 6 connectivity and dual-band 2.4GHz and 5GHz, along with advanced Wi-Fi features such as target wake time (TWT), MU-MIMO, MU-OFDMA, quality of service (QoS) and WPA3 Wi-Fi security.
The company said, to ensure that users’ Wi-Fi connectivity remains reliable even when Bluetooth devices are in use at the same time, the solutions support advanced Wi-Fi and Bluetooth coexistence.
Both single-chip solutions integrate an Arm Cortex-M33 microcontroller which is supported by embedded RAM and external flash and an integrated front-end module (iFEM) that supports low noise amplifier (LNA) and power amplifier (PA) functionality. The Filogic 130A also integrates an integrated HiFi4 DSP for more accurate far-field voice processing, always-on microphone capability with voice activity detection, and trigger word support.
Filogic 130 and Filogic 130A are designed to maximise power-efficiency in the smallest and lowest-power form factor, allowing devices to achieve Energy Star and Green Appliance ratings and certifications. The solutions also support secure boot and hardware crypto engines for robust security capabilities, and support a variety of interfaces including general purpose IOs such as SPI, I2C, I2S, IR input, UART, AUXADC, PWM and GPIO interfaces to make the design process easier.
Featured photo credit: MediaTek
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