Industrial Automation Asia – Weekly Products And Services Updates – [26.02.23]

 IAA Weekly Products and Services

IAA presents the latest exciting product news and updates in a mobile friendly text-based summary

Hikvision India Introduces Turbo HD Lamp Camera  for a wide range of use

Hikvision India has introduced Turbo HD Lamp Camera (DS 2CE18D0T-LFS) for a wide range of use in the market. This latest product in the Hikvision India product portfolio has been introduced to meet the customer requirements. These Turbo HD Lamp Cameras are applicable in various application scenarios.


Prefer colorful imaging

As ColorVu-enabled cameras continue to gain popularity, people are becoming accustomed to the supplemental visible light that accompanies their use during nighttime.


Require a product for two purposes: In poor infrastructure areas without street light and security cameras, they have strong demand for security monitoring and lighting.

Require the function of deterrence: Some scenarios require security products with strong deterrence, such as large bullet, and bright light.

Hikvision’s Lamp Camera meets the customers’ needs. It serves the dual purpose of Camera as well as light. The Smart Hybrid technology helps to meet various needs. It has low power consumption, max. 9 Watt.

The Dual Use (2 –In-1 Camera) has the 2 MP camera with 60 meter IR , Buit in Camera and 9 white Lights.

It has 3 Supplemental lighting modes i.e IR Mode, Smart Mode and White light Mode.

  • Before a car or person enters the area, IR gets on
  • When a car or person appears, the white light turns on
  • The a car or person goes out, IR gets on

Audio Over Coaxial: Built-in mic (up to 10 m) to record audio as an important evidence.

IP67 Ingress Protection: This camera has the IP67 Ingress Protection, which means one does not need to worry about bad weather conditions for its indoor and outdoor use.

Low Power Consumption: The power supply requirement is maximum 9 watt for lamp camera, while 12 Volt 1 Amp power supply is enough.

Application Scenarios:

The application scenes include the perimeter scenes.  The bright light gives strong warnings and provides colorful key information. In the inadequate infrastructure scenes, it is used as both a security camera and a lamp.

Landis+Gyr and SPAN Announce Partnership to Unlock Electrification and DER Flexibility at the Grid Edge

SPAN and Landis+Gyr today announced a strategic partnership to cost-effectively advance electrification, create grid flexibility, and build resilience. The collaboration brings together two energy industry leaders to help utilities improve utilization of existing assets, unlock Distributed Energy Resource (DER) flexibility management, and enhance customer engagement.

Landis+Gyr and SPAN – Integrated Panel

Modern utilities face many competing pressures, amplified by consumer adoption of DERs, regulatory focus on vehicle and home electrification, and ambitious commitments to decarbonize the grid. Utilities must meet renewable energy deployment goals while maintaining grid stability, and upgrade aging infrastructure to electrify homes and vehicles while keeping customer bills low. In addition, end customers and regulators expect customer empowerment to manage both their energy cost as well as their carbon footprint. Through this new partnership, SPAN and Landis+Gyr are combining best-in-class energy management solutions with industry leading grid edge intelligence to help utilities navigate this difficult landscape.


The co-innovated solution reimagines the interface between the home and the distribution grid, delivering a whole-home multi-asset virtual power plant (VPP), as well as offering unique tangible benefits to both utilities and end consumers, including:


  • Extends useful life of existing equipment

Intelligently manages loads to defer or avoid upgrades for homes and the distribution grid

  • Provides device-level high-resolution continuous waveform submetering

Unprecedented load visibility for analytics and simple measurement & verification

  • Allows control of the highest value loads with whole-home context

Orchestrates home loads based on real-time concurrent usage and customer preferences

  • Delivers superior homeowner experience

Provides customers total visibility and choice in load management priorities and participation


“The collaboration with Landis+Gyr allows us to advance AMI through device-level intelligence and control. Landis+Gyr’s high-resolution continuous waveform sensing, networking, and software capabilities perfectly complement SPAN’s household level energy orchestration capabilities, allowing us to amplify grid-level benefits and improve utilization of existing infrastructure. Furthermore, SPAN’s Home App empowers customers, providing critical transparency and prioritization of DERs, improving customer awareness of energy usage, and enabling enrollment in demand flexibility programs,” said Arch Rao, CEO of SPAN. “We’re thrilled to be working with Landis+Gyr to help utilities enable grid flexibility and advance their decarbonization programs.”

As the initial joint product from the partnership, Landis+Gyr and SPAN will offer an industry-first grid edge solution with circuit-level billing-grade metering, DER visibility, and controls. Addressing the increasing power demand driven by electrification of transportation and buildings will require new and innovative ways of managing the load at each premise. The joint product will improve utilization of existing utility infrastructure in addition to enabling utilities to avoid costly and time-consuming secondary distribution service upgrades by balancing loads to maintain peak power of the premise within the existing capabilities of the grid, furthering home and transportation electrification.

“The partnership between Landis+Gyr and SPAN not only expands our flexibility management platform, which enables utilities to ensure grid stability and reliability, but also helps them reduce costly grid infrastructure investments required for electrification. We’re particularly excited to bring SPAN’s service upgrade avoidance capabilities and intuitive app experience to our customers to empower both utilities and end consumers to drive energy efficiency and flexibility,” Werner Lieberherr, CEO of Landis+Gyr added. “The collaborative solution innovated by our two companies will revolutionize the way end consumers and utilities combine their efforts to manage energy better and decarbonize the grid as a result.”

SPAN and Landis+Gyr plan to evaluate the offering with US utilities, starting with pilots this year. By innovating on decarbonization-focused grid-edge products, the collaboration will help utilities and consumers support the energy transition in a smarter and more sustainable way.

Sonatype Introduces Cutting-Edge AI/ML Component Detection

Sonatype, the software supply chain optimization company, today announced artificial intelligence and machine learning (AI/ML) component detection, a first-of-its-kind capability, available as part of Sonatype Lifecycle. This technology fundamentally changes the way organizations select and monitor AI/ML software components, enabling them to accelerate software development while effectively managing the risks associated with AI.

The adoption of AI – particularly generative AI – in software development is rapidly growing. According to Sonatype’s 9th annual State of the Software Supply Chain report, there was a staggering 135% increase in the usage of AI/ML Components within corporate environments compared to the previous year. By the end of January 2024, this number saw an additional 20% increase in a matter of months. Further, Gartner reported that by 2027, 70% of professional developers will use AI powered coding tools. The widespread acceptance of AI is not only due to its expanding utility but also its transformative impact on speeding up software development.

“Organizations must be prepared for the wave of behavioral AI and generative AI that is already radically shaping the future of software development, much like open source did when Maven Central first launched in 2003. This is an exciting time for software development productivity and innovation; the data shows that enterprises adopting AI in new product innovation and software supply chains are disrupting competitors and moving faster than ever before,” said Mitchell Johnson, Chief Product Development Officer at Sonatype.  “At the same time, AI/ML introduces a whole new set of risks so it is crucial to have the data, precise identification, legal compliance, and policy enforcement in place to understand where and how these new capabilities are being used – without slowing anyone down.”

Sonatype’s new AI/ML component detection offers unrivaled visibility and control of AI/ML in the software you build. This enables you to safely use the best AI/ML suppliers in your software, transforming your software development lifecycle and security review processes – all with the same Sonatype platform you trust to optimize your open source usage.

Key Functions of AI/ML Component Detection:

AI/ML Usage Monitoring and Component Categorization: Gain visibility into AI usage and monitor its impact through comprehensive data insights and component categorization. Simply put, answer the question of where and how AI and GenAI are being used in your development organization.

AI Usage Management: Set policy constraints based on AI/ML taxonomies to effectively manage and control AI usage. Apply existing Sonatype Lifecycle policies to your AI/ML components for universal consistency.

Internal Detection of AI Models: Maintain a comprehensive catalog and index of AI/ML models and datasets to detect open source AI models used internally as well as modified versions of those AI models via our ground-breaking detection technology.

Sonatype’s Artificial Intelligence Component Detection is a game-changer for software development teams, providing them with the tools they need to innovate and stay ahead in today’s fast-paced technology landscape. With this new feature, organizations can confidently embrace AI/ML components while mitigating security, legal, and quality risks.

To learn more about Sonatype’s AI/ML Component Detection and how it can change your software development process, visit


HeyGears Unveils Automated Case-by-Case Clear Aligner Production Solution

HeyGears, a digital manufacturing solution innovator, has announced their Automated Case-by-Case Clear Aligner Production Solution during the 39th LMT LAB DAY Chicago (LDC) event. This innovative automation-focused digital dentistry solution is set to transform orthodontic workflows by streamlining production processes and boosting efficiency, delivering both economic and time savings.

Empowered by intelligent production processes and using the UltraCraft A3D Ortho’s expansive 3D printing build platform, this solution enables organization and printing of clear aligner models for a full patient’s case in a single operation, eliminating the need for manual sorting and significantly optimizing production efficiency.

Building upon this complete case-by-case approach, automation is seamlessly integrated throughout the entire production process, encompassing pre-processing, printing, and post-processing stages.

The solution incorporates advanced features including auto OCR code labeling, auto blockout, and auto trim line detection. By automating tasks like code labeling and blockout processes, along with generating unique OCR codes for each model for laser labeling and trim line trimming, valuable time is saved while minimizing errors. Furthermore, the A3D Ortho’s large-scale build platform enables printing of all models associated in a patient’s case in a single task, eliminating the need for multiple print preparations.

Moreover, the solution offers automated part removal and model collection by patient’s case during the production phase. This automation significantly reduces handling time and effectively enhances overall productivity levels.

During the post-processing stage, final steps are simplified by providing automated washing and curing without the need for manual sorting. In addition to time savings, it ensures consistent and reliable outcomes.

HeyGears’ Automated Case-by-Case Clear Aligner Production Solution sets a new industry benchmark. By optimizing production processes and enhancing efficiency, it empowers orthodontic professionals to deliver high-quality clear aligners with greater speed and accuracy. With advanced features, seamless automation, and holistic approach to clear aligner production, HeyGears reaffirms its commitment to pushing the boundaries of dental technology and  achieving excellence in orthodontics.

To learn more about our solution and how it can transform your dental production, please visit:


Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

  • Ansys electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications
  • Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel’s embedded multi-die interconnect bridge (EMIB) assembly technology
  • Ansys multiphysics analyses provide signoff verification of thermal integrity, power integrity, and mechanical reliability

Ansys and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology, which uses EMIB technology to connect the die flexibly and without the need for through-silicon vias (TSVs). Ansys’ accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability in advanced silicon systems for artificial intelligence (AI), high-performance computing, autonomous driving, and graphic processing.

Thermal analysis results for a 2.5D multi-die system generated by Ansys RedHawk-SC Electrothermal

Ansys RedHawk-SC Electrothermal is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies. It can perform thermal analysis with anisotropic thermal conduction, which is essential for Intel’s new backside power distribution technology. Thermal gradients also lead to mechanical stresses and warpage that can impact product reliability over time. Power integrity verification is done through chip/package co-simulation, which gives the 3D system-level context needed for maximum accuracy.

“Intel’s enablement of Intel 18A and EMIB technology is a differentiated approach to multi-die assembly that has a number of significant advantages over traditional stacking techniques,” said Rahul Goyal, vice president & general manager, product and design ecosystem enablement at Intel. “We will collaborate closely with Ansys to make the full benefit of this innovation easily accessible to our joint customers so they can create more competitive products.”

“Ansys has collaborated with Intel Foundry at the leading edge of 3D manufacturing technology to solve complex multiphysics challenges and meet stringent thermal, mechanical, performance, and reliability requirements,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys’ multiphysics signoff platform gives our mutual customers the flexibility to adopt EMIB technology for their system architecture and assemble the best-of-breed solutions for higher performance products and a smooth user experience.”


Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology

  • Ansys power integrity and on-chip electromagnetic analysis tools enable semiconductor products for HPC, graphics, and AI applications
  • Ansys Redhawk-SC, Ansys Totem, Ansys PathFinder, and Ansys RaptorX support power integrity, signal integrity, and reliability signoff requirements for the Intel 18A process technology
  • The Ansys multiphysics platform supports new Intel manufacturing technologies including RibbonFET transistors and backside power distribution

Intel Foundry certified Ansys multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.

Ansys RedHawk-SC results verifying the voltage drop in a large integrated circuit (IC)

The predictive accuracy of Ansys’ power and signal integrity platforms helps designers lower the power consumption and increase the performance of edge artificial intelligence (AI), graphic processing, and advanced computing products by minimizing over-design. Collaboration towards a smooth electronic design automation (EDA) flow can significantly increase productivity for joint customers.

Ansys RedHawk-SC and Totem are recognized as industry standards for power integrity signoff of digital and analog designs, respectively. The solutions’ cloud-enabled data infrastructure provides unparalleled capacity to analyze full-chip designs and multi-die assemblies. PathFinder uses the same elastic compute infrastructure to also verify the electrostatic discharge (ESD) protection circuitry found on all chips. The Ansys Raptor family models high-speed signals including on-chip electromagnetic coupling.

“Intel Foundry and Ansys have partnered to ensure our customers have access to accurate analysis solutions for the latest manufacturing innovations in our Intel 18A process technology,” said Rahul Goyal, vice president & general manager, product & design ecosystem enablement at Intel. “Partnerships across the industry are essential for solving challenges and taking advantage of the exciting opportunities opened up by this leading-edge silicon technology.”

“Ansys works with leading foundry partners like Intel Foundry to address complex multiphysics challenges and meet stringent power, performance, and reliability requirements,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys’ signoff platform helps empower mutual customers to accelerate design convergence with greater confidence thanks to the collaborative work between the companies to ensure silicon predictive accuracy and a stellar user experience.”



VoxelSensors Expands its Spatial and Empathic Computing Solutions with Gaze Tracking, Acquires EyeWay Vision’s IP, and Unveils the Plan for its First Spatial Awareness System for Mobile

VoxelSensors, a leading startup in sensing technologies, announced a significant step towards real-life communication and intuitive interaction in the digital world. This strategic announcement, unveiled at MWC Barcelona, entails the acquisition of EyeWay Vision’s intellectual and industrial property, along with their expertise in gaze tracking and projection technology for XR. By seamlessly integrating this technology with its innovative Single Photon Active Event Sensor (SPAES), VoxelSensors strengthens its leading position in Spatial and Empathic Computing for Mobile and XR to unlock next-generation user experiences across various devices.

This expansion follows the closing of VoxelSensors’ €9.5 million Seed Round, empowering its ambition to spearhead the fusion of depth sensing and gaze tracking for stellar spatial and empathic immersive experiences. The company is set to expedite the development and rollout of its technology with an upcoming Series-A funding round.

VoxelSensors acquires EyeWay Vision’s IP to advance Spatial and Empathic Computing

On a track to enhance spatial and empathic computing experiences, VoxelSensors has completed the acquisition of EyeWay Vision’s industrial and intellectual property (IP) portfolio and know-how. Founded in 2014, EyeWay Vision is an Israeli company pioneering immersive XR glasses. Its innovation includes a novel gaze-contingent projection architecture including underlying technology, such as dynamic exit pupil shifter, varifocal foveated projection, laser-based gaze tracker, and efficient sequential graphical pipeline.

This architecture simultaneously addresses many critical XR requirements, such as:

  • Power efficiency for all-day use, daylight visibility, and dynamic range
  • Solution for vergence accommodation conflict
  • Continuous varifocal interaction
  • Zero perceived latency and image persistence
  • Virtually pixel-less and photorealistic perceived 5K image
  • Situational awareness due to wide dynamic field-of-view

With this acquisition, VoxelSensors further strengthens its portfolio. The combined technology holds promise for truly immersive experiences across diverse sectors like entertainment, health, shopping, education, and professional applications.

“The acquisition of EyeWay Vision’s IPs and the mobile depth system mark key milestones for VoxelSensors,” stated Johannes Peeters, CEO of VoxelSensors. “Together, these advancements position us as a major player in the rapidly evolving spatial and empathic computing market for mobile and XR devices. By combining our technologies, we can offer seamless and intuitive interactions in these domains, significantly enhancing user experience while utilizing our efficient SPAES sensor.”

SPAES for Mobile

At MWC, VoxelSensors will preview its first Spatial Awareness system for mobile, powered by a single SPAES sensor and a single illuminator. This novel system is part of the company’s dedication to pushing the boundaries of low-power, low-latency, and precise spatial awareness and empathic computing for intuitive user interfaces, biometric face authentication, enhanced photos and videos, and mobile augmented experiences.

“The combined power of Single Photon Active Event Sensing and EyeWay Vision’s technology addresses customer demands for power-efficient, low-latency, and precise perception and interaction systems. This opens exciting new opportunities for integration in mobile and XR platforms, with fully immersive and intuitive experiences that redefine spatial and empathic computing,” said Ward van der Tempel, CTO of VoxelSensors. “The synergy of technologies pushes the boundaries of what is possible and marks a major step forward in our industry.”

Mitsubishi Electric Building Solutions to Supply Elevators and Escalators for New Capital Relocation Project in Indonesia

Orders received for 33 elevators and 22 escalators for key government facilities

Mitsubishi Electric Building Solutions Corporation (MEBS, Head Office: Chiyoda-Ku, Tokyo; President: Tadashi Matsumoto) has announced that PT. Mitsubishi Jaya Elevator and Escalator (MJEE), which is engaged in sales, manufacturing, installation, and maintenance of elevators and escalators in Indonesia, has secured a major order to supply a total of 55 units, comprising 33 elevators and 22 escalators, for the Indonesia New Capital Relocation Project (Phase 1).

Exterior view of the Presidential Palace and the Presidential Office in Indonesia’s new capital Nusantara (image) (Photo by the Ministry of Public Works and Housing of the Republic of Indonesia)Exterior view of the Presidential Palace and the Presidential Office in Indonesia’s new capital Nusantara (image) (Photo by the Ministry of Public Works and Housing of the Republic of Indonesia)

This order for elevators and escalators for key government facilities such as the Presidential Palace and the Executive Office of the President, which are under construction in Nusantara, the new city currently being developed as the future capital of Indonesia, is the result of MJEE’s solid business performance in the Indonesian elevator and escalator market and the high quality of its products and services.


Overview of the Indonesia Capital Relocation Project

The Indonesian government is planning to move the national capital from Jakarta to Nusantara in the eastern part of Kalimantan Island in an effort to solve a number of long-standing issues that affect the current capital, Jakarta, including a high population density due to the concentration of political and economic functions, rapid land subsidence, and frequent flooding during the rainy season, as well as to address the issue of regional disparities between Java and the rest of Indonesia.

The government has set a target date of 2045 for the complete relocation to the new capital. In the first phase of the relocation, several government functions are scheduled be relocated within 2024.


MEBS’s Elevator and Escalator Business in Indonesia

Indonesia is the third largest market for new elevators and escalators*1 among the ASEAN countries, after Vietnam and Thailand. Indonesia boasts the largest population and GDP in ASEAN, and is expected to continue to experience strong growth in demand along with sustained economic growth.

MJEE began selling elevators and escalators in Indonesia in 1996, and has since established itself as a market leader in the country. MJEE now has its own production base in Karawang, West Java, and has been responding to local needs by combining major parts imported from Thailand’s AMEC, our core base in Asia, with locally produced parts to achieve reduced costs and shorter lead times for high quality products.

Moreover, in accordance with Indonesia’s domestic product usage (P3DN) program*2, in September 2021, MJEE received a certificate indicating that a domestic component level (TKDN) of 40% or more had been reached for machine room-less elevators with a rated load capacity of 1,275~1,600 kg and speed of 105 m or less. This certification allows the company to actively participate in purchasing and procurement projects conducted by the Indonesian Government as well as by state-owned and other public entities, thereby accelerating the expansion of its elevator and escalator business in Indonesia. MEBS will continue to provide safe and reliable products and services to the Indonesian market through MJEE, while aiming to increase the domestic component level of its other models to 40% or more.

*1 Based on demand for 2022, according to MEBS’s own research

*2 A policy aimed at promoting the purchase and use of domestically produced products by the Indonesian government to achieve both growth in the Indonesian manufacturing industry and investor profits. As for government goods/service procurement., domestic products (meaning products with the domestic component level of 40% or more) are given priority. The domestic component level is calculated based on how much domestic production factors and costs such as raw materials, labor, and manufacturing overhead are used.

Major Orders From Car Manufacturers: Huge Interest In DIAvent

Freudenberg Sealing Technologies triples production capacity for its intelligent pressure compensation element in Germany and the USA

DIAvent Highflow

The pressure compensation element DIAvent HighFlow, known for its exceptional performance, enhances the safety of electric car batteries and is generating considerable interest from the automotive industry. This is proven by multiple major orders Freudenberg Sealing Technologies has received lately. Substantial increases in order volumes have come particularly from one Asian and one US automotive group.

“At a time when suppliers are fiercely competing for every order, we have successfully secured this and other major orders for our DIAvent product family. We are particularly thrilled about a series production order from the USA, which is unprecedented in DIAvent’s brief history,” says Ralf Schmid, Senior Vice President Special Sealing Division at Freudenberg Sealing Technologies. “In order to meet this huge demand, we have rapidly tripled our production capacities,” Schmid continues.

The first fully automated high-tech production cell for DIAvent HighFlow was launched in Reichelsheim, Germany, at the beginning of 2023. A structurally identical twin followed in December, just a few meters away in the same production hall. Due to space constraints in the location, a third DIAvent production line will be operational at the Berlin facility, also in Germany, in the first half of 2024. But that isn’t all. Freudenberg Sealing Technologies will start up at least one additional production line in early 2025 at its North American site in Shelbyville, Indiana, to fulfill the large US order. This exemplifies how Freudenberg Sealing Technologies is dynamically adjusting its capacity to meet the rapidly growing demand. Additionally, Freudenberg can cater to this demand through its global production network spanning Europe, America, and beyond.

DIAvent HighFlow unlike anything else in the industry

Since 2017, Freudenberg Sealing Technologies has been developing the DIAvent family, an array of intelligent pressure compensation elements that merge pressure equalization and emergency degassing into a single unit, thereby enhancing electric vehicle battery safety. The range extends from the basic DIAvent light ventilation element to the DIAvent HighFlow, which integrates bidirectional pressure compensation with an emergency degassing function in one component.

DIAvent HighFlow is the only product of its kind in the industry. Freudenberg engineers developed it to balance air pressure variations within the battery housing of an electric vehicle and to provide emergency degassing in case of thermal runaway. The component occupies 50 to 70 percent less space than similar solutions and is lighter due to its innovative UL94-V0-compliant plastic housing. This not only makes it more cost-effective than two separate units but also simplifies installation and reduces supply chain complexity. Moreover, it supports the use of batteries with higher power density, fulfilling the demands for range, performance, and safety in battery-powered vehicles.

“Our intelligent pressure compensation elements offer car manufacturers an efficient way to enhance the safety of electric vehicles,” explains Ulrich Huth, President Automotive Sales at Freudenberg Sealing Technologies. “The product we offer them with DIAvent HighFlow is unparalleled in the industry. Its robust sales growth reflects its outstanding market reception.”

Quality that impresses the automotive industry

The consistent high quality of each DIAvent unit is highly valued and sought after in the automotive industry. The production process encompasses various controls to maintain this standard. For instance, the opening pressure and tightness of the diaphragm responsible for emergency degassing are automatically tested. The system also verifies the correct air flow rate of the breathable and waterproof e-PTFE fleece disk, ensuring proper ventilation of the battery during regular operation.

Without exception, each part must undergo these kinds of tests and various 360-degree camera inspections in order to receive a laser engraving as a seal of quality at the end. This documents the functionality and at the same time makes it possible to trace each individual pressure compensation element.

“Our clients in the automotive industry appreciate the reliability and trust they can place in Freudenberg Sealing Technologies as their partner in the emerging field of electromobility,” says Schmid.

Investing in the future

Freudenberg Sealing Technologies is also investing in the continued development of the DIAvent product family. For example, customized modifications to the battery housing’s fastening mechanism are being developed based on the technical foundation of the DIAvent HighFlow. It remains crucial that these kinds of special models can also be produced economically and reliably using standardized production technology.

FLIR Introduces CM276 Professional Clamp Meter and Thermal Imaging Camera for Electrical System Test and Measurement

More Than Just a Clamp Meter, the New FLIR CM276 Features MSX Dual Visible-Infrared Imaging, LED Worklight, and On-Board Storage for Better Situational Awareness and Data Management.

FLIR, a Teledyne Technologies company, today released the FLIR CM276 professional clamp meter with infrared imaging, a visual camera, and solar photovoltaic (PV) direct current (DC) built for electrical test and measurement. The CM276 empowers electrical professionals to troubleshoot electrical system components with Infrared Guided Measurement (IGM) and radiometric multispectral dynamic imaging (MSX), which overlays visible camera details onto the thermal image, helping users safely execute inspections and identify hazards before contact is made.

“The FLIR CM276 is the most versatile clamp meter in its class, providing dual-thermal visible imagery, even in total darkness thanks to the new LED worklight, and this helps inspectors identify potential issues safely and quickly,” said Rob Milner, global business development director, FLIR. “To speed post-inspection workflows and data sharing between up to seven devices, testing results can be shared with colleagues and clients through the free METERLiNK app available on iOS and Android, supporting thermal, visible, and MSX images and video clips, individually, or as part of a comprehensive post-inspection report.”

The CM276 is an effective tool for a variety of commercial and industrial electrical inspection needs, including solar PV DC measurements up to 1500 V with optional PV test leads. It features variable frequency drive (VFD) mode, True RMS, and Low Impedance (LoZ) mode for other advanced electrical test and measurement needs, enabling inspectors to leverage one tool for various scenarios.

Built into the CM276 are a 160 x 120 thermal resolution Lepton thermal camera module, a visible camera, and an LED worklight for illuminating dark cabinets and spaces. Everything is housed inside a ruggedized casing that is IP40 rated and drop-tested up to two meters. The clamp meter includes in-device rechargeable lithium polymer batteries for all-day use, meaning users never need to worry about carrying around extra batteries or packs.

Bluetooth Integration with METERLiNK App

During and after inspections, operators can leverage the METERLiNK app to review meter logs, examine data trends, and share results with team members. Each CM276 clamp meter can store up to 30,000 radiometric images and 100 log files on board, making report generation simple.

The CM276 includes one set of CAT IV-600V/ CAT III-1000V Test Leads, a USB Type-A-to-C cable, a storage pouch, a quick start guide, and a 10-year limited warranty. Users may purchase separately the optional TA85 – PV test leads (CAT III-1500V) and the TA86 – MC4 PV plug leads (CAT III-1500V) for solar power inspections.

For more information on the FLIR CM276 Clamp Meter, including global pricing, availability, and purchasing options, visit

Rohde & Schwarz receives GTI Award 2024 for its 5G RedCap test solution

Rohde & Schwarz received the Innovative Breakthrough in Mobile Technology Award at GTI Awards 2024 for its R&S CMX500 radio communication tester’s support of RedCap testing from early R&D to certification and conformance. The GTI Awards takes place during Mobile World Congress and recognizes industry achievements and successes in 5G development across a wide range of market segments.

The R&S CMX500 OBT was recognized by the GTI for making RedCap testing easy, from R&D to certification and conformance testing.

The GTI Award is granted by the Global TD-LTE Initiative (GTI), an organization of leading global operators that has successfully supported the commercialization of TD-LTE and 5G NR networks and services. The Innovative Breakthrough in Mobile Technology Award is given to technologies based on how they meet the Proposal for caption: The R&S CMX500 OBT was recognized by the GTI for making RedCap testing easy, from R&D to certification and conformance testing.needs of GTI operators, as well as their innovativeness, benefits, market potential, sustainability and impact. Rohde & Schwarz received this award for its R&S CMX500 one-box tester (OBT), a leading test solution that covers the entire 5G Reduced Capability (RedCap) lifecycle.

RedCap is a 5G technology defined in 3GPP Release 17. As a reduced-functionality version of 5G, it has significantly lower cost compared to 5G eMBB. It is characterized by mid-range data throughput, low power consumption, low complexity and the ability to support a large number of devices. This makes it particularly attractive for IoT applications.

The R&S CMX500 OBT verifies the various RedCap aspects specified in 3GPP 5G Rel.17 for R&D, certification and conformance testing. It covers network access restrictions, bandwidth parts (BWP) and bandwidth part switching, power saving and other protocol signaling procedures. The platform has also been enhanced to verify proper operation of RedCap terminal devices in legacy networks.

Christoph Pointner, Senior Vice President of Mobile Network Testers at Rohde & Schwarz, who accepted the award during the ceremony on February 27, 2024 at MWC Barcelona, said: “We are honored to receive the prestigious GTI Award for our R&S CMX500 one-box signaling tester for its comprehensive support of 5G RedCap technology. This recognition is a testament to our striving commitment to push the boundaries of mobile communications testing to meet the diverse needs of network operators and device manufacturers, paving the way for new technologies.”

For more information on RedCap testing Rohde & Schwarz, visit:

Siemens launches Gridscale X, paving the way for autonomous grid management

  • Gridscale X software enables utilities to scale grid capacity and increase DER visibility, essential for grid decarbonization
  • With Gridscale X, grid operators can accelerate their digital transformation in the planning, operations, and maintenance phase
  • Gridscale X is part of the Siemens Xcelerator portfolio, complemented by its extensive and open partner ecosystem

Siemens has announced the launch of Gridscale X, paving the way towards the vision of autonomous grid management, accelerating digital transformation for grid operators at speed and scale.

With Gridscale X, Siemens provides modular software to support utilities to tackle their most pressing challenges related to the energy transition. Gridscale X makes it possible to scale grid capacity fast, handle the complexity of DERs and increase grid flexibility with software that is easy to deploy and fast to integrate into existing IT and OT landscapes. This represents a new era of grid management and adds increased value to new and existing customers through planning, operations, and maintenance.

“Grid requirements are changing tremendously, driven by a seven-fold increase in distributed energy resources, putting enormous pressure on power utilities. Gridscale X enables grid operators to rethink grid management, increase capacity fast, and leverage distributed energy resources to improve customer satisfaction. It ultimately empowers utilities to reach net zero, while keeping their grids stable and reliable,” said Sabine Erlinghagen, CEO Siemens Grid Software.

Accelerating the energy transition through Siemens Xcelerator

As a part of Siemens Xcelerator, Gridscale X software is developed with the core design principles of interoperability, flexibility, openness, availability as a service, and with the highest level of cybersecurity. This means that Gridscale X can meet and adapt to the evolving needs of the industry, complemented by Siemens Xcelerator’s open partner ecosystem. Siemens Xcelerator is an open digital business platform to accelerate digital transformation and value creation.

Gridscale X: A new era of grid management with an extensive software offering

Two new Gridscale X software products were announced this week at the Siemens Grid Software Summit and Distributech event in Orlando, USA. Building on an already extensive grid software portfolio, Gridscale X DER Insights and Gridscale X Network Model Manager will enable power utilities to gain visibility over their grid and create a centralized network model. DER Insights enables utilities to protect critical infrastructure by gaining better insights into what is happening behind the meter, and how these resources impact grid equipment. Meanwhile, Network Model Manager is a consistent network model management app and data repository that supports operators with more efficient grid planning, development, and operations.







IAA Weekly Reports – Industry News and Trends – [26.02.24]
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